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Home > Thèses et HDR > Thèses en 2019

05/04/2019 - Johan LE LESLE

by Laurent Krähenbühl - published on , updated on

Agenda

  • Friday 5 April 2019 10:00-11:30 -

    Thèse Johan LE LESLE

    Résumé :

    Conception, Modélisation et  Évaluation d’un Convertisseur AC/DC Bidirectionnel Hautement Intégré / Design, Modelling and Evaluation of a Bidirectional Highly Integrated AC/DC Converter

    Lieu : Amphi 1bis, Bâtiment W1, Ecole Centrale de Lyon (Ecully)

    Notes de dernières minutes : {Soutenance en langue anglaise}


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Johan Le Leslé defends his PhD on April 05, 2019 at 10:00 AM
Location : Ecole Centrale de Lyon, Bâtiment W1, Amphi 1bis.

Title : Design, Modelling and Evaluation of a Bidirectionnal Highly Integrated AC/DC Converter

Jury :

  • Mme Edith Clavel (G2ELab INP Grenoble - UGA), rapporteur
  • M. Junichi Itoh (Université de Nagaoka), rapporteur
  • M. François Forest (Université de Montpellier)
  • M. Cyril Buttay (CNRS, INSA de Lyon)
  • M. Bruno Sareni (INP-ENSEEIHT)
  • M. Florent Morel (École Centrale de Lyon), encadrant
  • M. Christian Vollaire (École Centrale de Lyon), directeur de thèse
  • M. Stefan Mollov (Mitsubishi Electric R&D Centre Europe), invité
  • M. Nicolas Degrenne (Mitsubishi Electric R&D Centre Europe), encadrant invité
  • M. Guillaume Lefèvre (Institut National de l’Energie Solaire), invité

Abstract :
Nowadays, the green energy sources are replacing fossil energies. To assure proper interconnections between all these different electrical facilities, power electronics is mandatory. The main requirements of next generation converters are high efficiency, high power density, high reliability and low-cost. The Printed Circuit Board (PCB) integration of dies and/or passives is foreseen as a promising, low-cost and efficient approach. The manufacturing time and cost of power converters can be drastically reduced. Moreover, integration allows the converter performances to be improved. For this purpose, an original 3D folded power inductor concept using PCB technology is introduced. It is low cost for mass production and presents good reproducibility. A partial milling of the PCB is used to allow bending and building the inductor winding. Prototypes are designed through an optimisation procedure. Electrical and thermal tests are performed to validate the applicability in power converters.
The development of an optimisation procedure for highly integrated converters, using PCB embedding, is presented. All important choices, facilitating the PCB integration, e.g. reduction of passive components, are presented. It includes the selection of the suitable converter topology with the associated modulation. The design procedure and implemented analytical models are introduced. It results in four interleaved full-bridges operating with low (50 Hz) and high (180 kHz) frequency legs. The configuration allows high current ripple in the input inductors inducing zero voltage switching (ZVS) for all the semiconductors, and for a complete grid period. The impact of high current ripple on the EMI filter is compensated by the interleaving. Two prototypes of a 3.3 kW bidirectional AC/DC converters are presented, theoretical and practical results are discussed.
To further increase the power density of the overall system, a Buck power pulsating buffer is investigated. The optimisation procedure is derived from the procedure implemented for the AC/DC converter. The result favours an original approach, where the converter also operates with ZVS along the entire main period at a fixed switching frequency. The selected technologies for prototyping are integration friendly as ceramic capacitors and PCB based inductors are implemented in the final prototype.

Key Words :
Optimisation procedure, pareto front, Power Factor Corrector, Power Pulsating Buffer, integration, modulation, wide band-gap devices, soft switching, EMC



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